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0879143205 Datasheet (PDF) - Molex Electronics Ltd.

Part #	0879143205

Description	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 32 Circuits, 0.76關m (30關) Gold (Au) Plating, Tray Packaging, Lead-free

File Size	4411.77 Kbytes

Html View	1 2 3 4 5 6 7 8 9 Next

Manufacturer	MOLEX10 [Molex Electronics Ltd.]

Direct Link	http://www.molex.com

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0879143205 Datasheet (PDF) - Molex Electronics Ltd.

Similar Part No. - 0879143205

Manufacturer	Part #	Datasheet	Description
Molex Electronics Ltd.	0879143203	770Kb / 11P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 2.54關m (1.00關) Tin (Sn) Selective Plating, 32 Circuits, Tray Packaging,Lead-free

Similar Description - 0879143205

Manufacturer	Part #	Datasheet	Description
Molex Electronics Ltd.	0879144405	4Mb / 57P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 44 Circuits, 0.76關m (30關) Gold (Au) Plating, Tray Packaging, Lead-free
	0879143435	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tray Packaging, Lead-free
	0879143203	770Kb / 11P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 2.54關m (1.00關) Tin (Sn) Selective Plating, 32 Circuits, Tray Packaging,Lead-free
	0879114212	375Kb / 6P	2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 42 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tube Packaging, Lead-free
	0879144204	4Mb / 57P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 42 Circuits, 0.38關m (15關) Gold (Au) Plating, Tray Packaging, Lead-free
	0879144201	770Kb / 11P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 42 Circuits, 0.38關m (15關) Gold (Au) Plating, Tray Packaging, Lead-free
	0879142815	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75關m (30關) Gold (Au) Plating, Tray Packaging, Lead-free
	0879141001	770Kb / 11P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 10 Circuits, 0.38關m (15關) Gold (Au) Plating, Tray Packaging, Lead-free
	0879143216	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 32 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879140001	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 10 Circuits, 0.38關m (15關) Gold (Au) Plating, Tray Packaging, Lead-free

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