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SST11CP15 Datasheet(PDF) 17 Page - Microchip Technology |
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SST11CP15 Datasheet(HTML) 17 Page - Microchip Technology |
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17 / 18 page ![]() ©2013 Silicon Storage Technology, Inc. DS70005016C 08/13 17 4.9-5.9 GHz High-Linearity Power Amplifier SST11CP15 Data Sheet Packaging Diagrams Figure 15:12-contact Ultra-thin Quad Flat No-lead (UQFN) SST Package Code: QUB 12-uqfn-2x2-QUB-2.0 0.4 BSC See notes 2 and 3 Pin #1 0.25 0.15 0.92 0.34 0.24 TOP VIEW BOTTOM VIEW SIDE VIEW 1mm 0.265 0.165 Pin #1 (laser engraved see note 2) 2.00 ±0.05 2.00 ±0.05 0.075 Note: 1. Similar to JEDEC JEP95 UQFN/USON variants, though number of contacts and some dimensions are different. 2. The topside pin #1 indicator is laser engraved; its approximate shape and location is as shown. 3. From the bottom view, the pin #1 indicator may be either a curved indent or a 45-degree chamfer. 4. The external paddle is electrically connected to the die back-side and to VSS. This paddle must be soldered to the PC board; it is required to connect this paddle to the VSS of the unit. Connection of this paddle to any other voltage potential will result in shorts and electrical malfunction of the device. 5. Untoleranced dimensions are nominal target dimensions. 6. All linear dimensions are in millimeters (max/min). 0.60 0.50 0.05 Max |
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