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EVB-USB2517 Datasheet(PDF) 2 Page - SMSC Corporation |
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EVB-USB2517 Datasheet(HTML) 2 Page - SMSC Corporation |
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2 / 6 page ![]() EVB-USB2517 Evaluation Board User Manual (Revision A) Revision 1.2 (1-7-09) 2 SMSC EVB-USB2517 Revision A USER MANUAL 1 Overview The SMSC USB2517 is a low-power, OEM configurable, hub controller IC with 7 downstream ports for embedded USB solutions. The USB2517 is a USB 2.0-compliant MultiTRAK™ hub that supports low- speed, full-speed, and hi-speed downstream devices. The EVB-USB2517 evaluation board demonstrates a stand alone application for the hub with all of the features listed below. The SMSC evaluation board demonstrates advanced power saving options and configurable port assignments. 1.1 Features Low pin count: 64-pin QFN package Hi-Speed (480 Mbits/s), Full-Speed (12 Mbits/s), and Low-Speed (1.5 Mbits/s) compatible Operates from a single voltage (+5.0 V, regulated) 'wall wart' external power supply Low cost 4-layer design: two outer signal layers, power and ground inner layers Self-powered operation Multi-TT enabled Supports internal default hub configuration (optional support configuration from external EEPROM) Single onboard +3.3 V regulator Single crystal clock source Individual port over-current sensing Individual port power control Port OCS/port power control interface with LEDs for optional port power indication Red LED indicator for Hi-Speed hub state Standard USB amber/green LED indicators for operational state indication EMI suppression provided by selection of capacitors and inner power/ground PCB layers 1.2 General Description The EVB-USB2517 is a low-cost evaluation platform featuring the USB2517 7-port, low-power, hi- speed USB 2.0 hub with MultiTRAK™ technology. The platform is designed to robustly demonstrate the unique features of this device using a low-cost PCB implementation with individual port power control. The EVB-USB2517 is designed with efficient power usage for the implementation of a hi-speed USB hub with minimal bill-of-materials. Schematics, layout, and bill-of-materials are included to minimize new product development time. Revision A of the EVB-USB2517 features a four-layer printed circuit board to improve coupling between power and ground layers to reduce EMI. |
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