AD811 datasheet(21/21 Pages) AD

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AD811

Data Sheet

Rev. G | Page 20 of 20

Figure 53. 16-Lead Standard Small Outline Package [SOIC_W]

Wide Body (RW-16)

Dimensions shown in millimeters and (inches)

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

AD811ANZ

−40°C to +85°C

8-Lead Plastic Dual In-Line Package [PDIP]

N-8

AD811AR-16

−40°C to +85°C

16-Lead Standard Small Outline Package [SOIC_W]

RW-16

AD811ARZ-16

−40°C to +85°C

16-Lead Standard Small Outline Package [SOIC_W]

RW-16

AD811ARZ-16-REEL

−40°C to +85°C

16-Lead Standard Small Outline Package [SOIC_W]

RW-16

AD811ARZ-16-REEL7

−40°C to +85°C

16-Lead Standard Small Outline Package [SOIC_W]

RW-16

AD811JR-EBZ

8-Lead SOIC Evaluation Board

AD811JRZ

0°C to +70°C

8-Lead Standard Small Outline Package [SOIC_N]

R-8

AD811JRZ-REEL7

0°C to +70°C

8-Lead Standard Small Outline Package [SOIC_N]

R-8

AD811SQ/883B

−55°C to +125°C

8-Lead Ceramic Dual In-Line Package [CERDIP]

Q-8

AD811SE/883B

−55°C to +125°C

20-Terminal Ceramic Leadless Chip Carrier [LCC]

E-20-1

AD811ACHIPS

−40°C to +85°C

DIE

AD811SCHIPS

−55°C to +125°C

DIE

1 Z = RoHS Compliant Part.

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-013-AA

10.50 (0.4134)

10.10 (0.3976)

0.30 (0.0118)

0.10 (0.0039)

2.65 (0.1043)

2.35 (0.0925)

10.65 (0.4193)

10.00 (0.3937)

7.60 (0.2992)

7.40 (0.2913)

0.75 (0.0295)

0.25 (0.0098)

45°

1.27 (0.0500)

0.40 (0.0157)

COPLANARITY

0.10

0.33 (0.0130)

0.20 (0.0079)

0.51 (0.0201)

0.31 (0.0122)

SEATING

PLANE

8°

0°

1.27 (0.0500)

BSC

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D00866-0-4/15(G)

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