© 2017 Littelfuse, Inc.

Specifications are subject to change without notice.

Revised: 02/23/17

General Purpose ESD Protection - SP1007 Series

Pulse Waveform

Capacitance vs. Reverse Bias

0.0

0.5

1.01.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

Bias Voltage (V)

0.0

1.0

2.0

3.0

4.0

5.0

6.0

7.0

SP1007-01ETG

SP1007-01WTG

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

110%

0.0

5.0

10.0

15.0

20.0

25.0

30.0

Time (s)

Insertion Loss (S21) I/O to GND

Frequency (MHz)

-35

-30

-25

-20

-15

-10

-5

0

-40

-45

10

100

1000

Time

25

time to peak temperature

Preheat

Preheat

Ramp-up

Ramp-up

Ramp-down

Ramp-do

Critical Zone

Critical Zone

Reflow Condition

Pb – Free assembly

Pre Heat

-Temperature Min (T

150°C

-Temperature Max (T

200°C

-Time (min to max) (t

60 – 180 secs

Average ramp up rate (Liquidus) Temp

(T

3°C/second max

T

3°C/second max

Reflow

-Temperature (T

217°C

-Temperature (t

60 – 150 seconds

PeakTemperature (T

Time within 5°C of actual peak

Temperature (t

20 – 40 seconds

Ramp-down Rate

6°C/second max

Time 25°C to peakTemperature (T

8 minutes Max.

Do not exceed

260°C

Soldering Parameters

Product Characteristics of SOD-882 Package

Lead Plating

Pre-Plated Frame

Lead Material

Copper Alloy

Lead Coplanarity

0.0004 inches (0.102mm)

Substitute Material

Silicon

Body Material

Molded Epoxy

Flammability

UL 94 V-0

Notes :

1. All dimensions are in millimeters

2. Dimensions include solder plating.

3. Dimensions are exclusive of mold flash & metal burr.

4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.

5. Package surface matte finish VDI 11-13.