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DMP3036SFG-13 Datasheet(PDF) 2 Page - Diodes Incorporated |
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DMP3036SFG-13 Datasheet(HTML) 2 Page - Diodes Incorporated |
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2 / 7 page ![]() DMP3036SFG Document number: DS37038 Rev. 5 - 2 2 of 7 www.diodes.com December 2017 © Diodes Incorporated DMP3036SFG Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Drain-Source Voltage VDSS -30 V Gate-Source Voltage VGSS ±25 V Continuous Drain Current (Note 6) VGS = -10V TA = +25°C TA = +70°C ID -8.7 -7.0 A Continuous Drain Current (Note 7) VGS = -10V TC = +25°C TC = +70°C ID -30 -25 A Continuous Drain Current (Note 6) VGS = -5V TA = +25°C TA = +70°C ID -7.2 -5.8 A Continuous Drain Current (Note 7) VGS = -5V TC = +25°C TC = +70°C ID -30 -24 A Pulsed Drain Current (10 μs Pulse, Duty Cycle = 1%) IDM -80 A Maximum Continuous Body Diode Forward Current (Note 6) IS -3.6 A Avalanche Current (Note 7) L=0.3mH IAS -17.5 A Avalanche Energy (Note 7) L=0.3mH EAS 64 mJ Thermal Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Total Power Dissipation (Note 5) PD 0.9 W Thermal Resistance, Junction to Ambient (Note 5) Steady State RJA 137 °C/W t<10s 65 °C/W Total Power Dissipation (Note 6) PD 2.3 W Thermal Resistance, Junction to Ambient (Note 6) Steady State RJA 55 °C/W t<10s 26 °C/W Thermal Resistance, Junction to Case (Note 7) RJC 3.5 °C/W Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 8) Drain-Source Breakdown Voltage BVDSS -30 - - V VGS = 0V, ID = -250μA Zero Gate Voltage Drain Current IDSS - - -1.0 μA VDS = -30V, VGS = 0V Gate-Source Leakage IGSS - - ±100 nA VGS = ±25V, VDS = 0V ON CHARACTERISTICS (Note 8) Gate Threshold Voltage VGS(TH) -1.0 -2.0 -2.5 V VDS = VGS, ID = -250μA Static Drain-Source On-Resistance RDS(ON) - 13 20 m Ω VGS = -10V, ID = -8A - 18.4 29 VGS = -5V, ID = -5A Diode Forward Voltage VSD - -0.7 -1.2 V VGS = 0V, IS = -1A DYNAMIC CHARACTERISTICS (Note 9) Input Capacitance Ciss - 1931 - pF VDS = -15V, VGS = 0V, f = 1.0MHz Output Capacitance Coss - 226 - pF Reverse Transfer Capacitance Crss - 168 - pF Gate Resistance Rg - 10.9 - Ω VDS = 0V, VGS = 0V, f = 1MHz Total Gate Charge VGS = -5V Qg - 8.8 - nC VDS = -15V, ID = -10A Total Gate Charge VGS = -10V Qg - 16.5 - nC Gate-Source Charge Qgs - 2.6 - nC Gate-Drain Charge Qgd - 3.6 - nC Turn-On Delay Time tD(ON) - 8.2 - ns VGS = -10V, VDD = -15V, RGEN = 3Ω, ID = -10A Turn-On Rise Time tR - 14 - ns Turn-Off Delay Time tD(OFF) - 65 - ns Turn-Off Fall Time tF - 31.6 - ns Reverse Recovery Time tRR - 9.3 - ns IF = -8A, di/dt = 500A/µs Reverse Recovery Charge QRR - 12.2 - nC Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout. 6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate. 7. Thermal resistance from junction to soldering point (on the exposed drain pad). 8. Short duration pulse test used to minimize self-heating effect. 9. Guaranteed by design. Not subject to product testing. |
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