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DMP3036SFG-13 Datasheet(PDF) 2 Page - Diodes Incorporated

Part # DMP3036SFG-13
Description  30V P-CHANNEL ENHANCEMENT MODE MOSFET
PDF  7 Pages
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

DMP3036SFG-13 Datasheet(HTML) 2 Page - Diodes Incorporated

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DMP3036SFG
Document number: DS37038 Rev. 5 - 2
2 of 7
www.diodes.com
December 2017
© Diodes Incorporated
DMP3036SFG
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Drain-Source Voltage
VDSS
-30
V
Gate-Source Voltage
VGSS
±25
V
Continuous Drain Current (Note 6) VGS = -10V
TA = +25°C
TA = +70°C
ID
-8.7
-7.0
A
Continuous Drain Current (Note 7) VGS = -10V
TC = +25°C
TC = +70°C
ID
-30
-25
A
Continuous Drain Current (Note 6) VGS = -5V
TA = +25°C
TA = +70°C
ID
-7.2
-5.8
A
Continuous Drain Current (Note 7) VGS = -5V
TC = +25°C
TC = +70°C
ID
-30
-24
A
Pulsed Drain Current (10
μs Pulse, Duty Cycle = 1%)
IDM
-80
A
Maximum Continuous Body Diode Forward Current (Note 6)
IS
-3.6
A
Avalanche Current (Note 7) L=0.3mH
IAS
-17.5
A
Avalanche Energy (Note 7) L=0.3mH
EAS
64
mJ
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Total Power Dissipation (Note 5)
PD
0.9
W
Thermal Resistance, Junction to Ambient (Note 5)
Steady State
RJA
137
°C/W
t<10s
65
°C/W
Total Power Dissipation (Note 6)
PD
2.3
W
Thermal Resistance, Junction to Ambient (Note 6)
Steady State
RJA
55
°C/W
t<10s
26
°C/W
Thermal Resistance, Junction to Case (Note 7)
RJC
3.5
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-55 to +150
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
BVDSS
-30
-
-
V
VGS = 0V, ID = -250μA
Zero Gate Voltage Drain Current
IDSS
-
-
-1.0
μA
VDS = -30V, VGS = 0V
Gate-Source Leakage
IGSS
-
-
±100
nA
VGS = ±25V, VDS = 0V
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
VGS(TH)
-1.0
-2.0
-2.5
V
VDS = VGS, ID = -250μA
Static Drain-Source On-Resistance
RDS(ON)
-
13
20
m
Ω
VGS = -10V, ID = -8A
-
18.4
29
VGS = -5V, ID = -5A
Diode Forward Voltage
VSD
-
-0.7
-1.2
V
VGS = 0V, IS = -1A
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
Ciss
-
1931
-
pF
VDS = -15V, VGS = 0V,
f = 1.0MHz
Output Capacitance
Coss
-
226
-
pF
Reverse Transfer Capacitance
Crss
-
168
-
pF
Gate Resistance
Rg
-
10.9
-
Ω
VDS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge VGS = -5V
Qg
-
8.8
-
nC
VDS = -15V, ID = -10A
Total Gate Charge VGS = -10V
Qg
-
16.5
-
nC
Gate-Source Charge
Qgs
-
2.6
-
nC
Gate-Drain Charge
Qgd
-
3.6
-
nC
Turn-On Delay Time
tD(ON)
-
8.2
-
ns
VGS = -10V, VDD = -15V,
RGEN = 3Ω, ID = -10A
Turn-On Rise Time
tR
-
14
-
ns
Turn-Off Delay Time
tD(OFF)
-
65
-
ns
Turn-Off Fall Time
tF
-
31.6
-
ns
Reverse Recovery Time
tRR
-
9.3
-
ns
IF = -8A, di/dt = 500A/µs
Reverse Recovery Charge
QRR
-
12.2
-
nC
Notes:
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. Thermal resistance from junction to soldering point (on the exposed drain pad).
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.



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