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© Koninklijke Philips Electronics N.V. 2004. All rights reserved.

Product data sheet

Rev. 01 — 5 April 2004

4 of 7

Philips Semiconductors

BAP70-05

Silicon PIN diode

8.

Package outline

Fig 3.

Package outline.

UNIT

max.

cD

E

Qw

v

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

97-02-28

99-09-13

IEC

JEDEC

EIAJ

mm

0.1

0.48

0.38

0.15

0.09

3.0

2.8

1.4

1.2

0.95

e

1.9

2.5

2.1

0.55

0.45

0.1

0.2

DIMENSIONS (mm are the original dimensions)

0.45

0.15

SOT23

TO-236AB

bp

D

e1

e

A

A1

Lp

Q

detail X

HE

E

B

A

B

0

1

2 mm

scale

A

1.1

0.9

c

X

12

3

Plastic surface mounted package; 3 leads

SOT23