CYUSB303X datasheet(50/54 Pages) CYPRESS

50 / 54 page

CYUSB303X

Document Number: 001-84160 Rev. *G

Page 50 of 54

Package Diagram

Figure 32. 121-ball FBGA (10 × 10 × 1.2 mm (0.30 mm Ball Diameter)) Package Outline, 001-54471

N IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS FOR MATRIX

WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW,

WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW,

DEFINE THE POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW.

"SD" AND "SE" ARE MEASURED WITH RESPECT TO DATUMS A AND B AND

SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION.

SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION.

"e" REPRESENTS THE SOLDER BALL GRID PITCH.

DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A

SOLDER BALL POSITION DESIGNATION PER JEP95, SECTION 3, SPP-020.

"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED SOLDER

A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK

NOTES:

1. ALL DIMENSIONS ARE IN MILLIMETERS.

0.25

0.00

0.80 BSC

0.30

121

0.35

DIMENSIONS

SYMBOL

0.15

MIN.

8.00 BSC

10.00 BSC

NOM.

1.20

MAX.

0.00

METALIZED MARK, INDENTATION OR OTHER MEANS.

"SD" = eD/2 AND "SE" = eE/2.

PLANE PARALLEL TO DATUM C.

"SD" OR "SE" = 0.

SIZE MD X ME.

BALLS.

11 10

121XØb

Ø0.15

Ø0.08 M

0.08 C

0.20 C

DETAIL A

TOP VIEW

BOTTOM VIEW

SIDE VIEW

DETAIL A

A1 CORNER

0.10

(datum A)

(datum B)

001-54471 *E

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