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XP-G Datasheet(PDF) 2 Page - Cree, Inc |
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XP-G Datasheet(HTML) 2 Page - Cree, Inc |
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2 / 28 page ![]() Copyright © 2009-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. Other trademarks, product, and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. 2 XLamp® Xp-G LED ChArACtEristiCs Characteristics unit Minimum typical Maximum Thermal resistance, junction to solder point °C/W 4 Viewing angle (FWHM) degrees 125 Temperature coefficient of voltage mV/°C -2.1 ESD withstand voltage (HBM per Mil-Std-883D) v 8000 DC forward current mA 1500 Reverse voltage v 5 Forward voltage (@ 350 mA, 25 °C) v 2.9 3.25 Forward voltage (@ 700 mA, 25 °C) v 3.05 Forward voltage (@ 1000 mA, 25 °C) v 3.15 Forward voltage (@ 1500 mA, 25 °C) v 3.25 LeD junction temperature °C 150 |
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