Electronic Components Datasheet Search
  New Zealand  ▼
ALLDATASHEET.CO.NZ

X  

LP6230C Datasheet(PDF) 6 Page - Lowpower Semiconductor inc

Part # LP6230C
Description  1.0MHz,24V/2.0A High Performance, Boost Converter
PDF  7 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  POWER [Lowpower Semiconductor inc]
Direct Link  http://www.lowpowersemi.com
Logo POWER - Lowpower Semiconductor inc

LP6230C Datasheet(HTML) 6 Page - Lowpower Semiconductor inc

  LP6230C Datasheet HTML 1Page - Lowpower Semiconductor inc LP6230C Datasheet HTML 2Page - Lowpower Semiconductor inc LP6230C Datasheet HTML 3Page - Lowpower Semiconductor inc LP6230C Datasheet HTML 4Page - Lowpower Semiconductor inc LP6230C Datasheet HTML 5Page - Lowpower Semiconductor inc LP6230C Datasheet HTML 6Page - Lowpower Semiconductor inc LP6230C Datasheet HTML 7Page - Lowpower Semiconductor inc  
Zoom Inzoom in Zoom Outzoom out
 6 / 7 page
background image
LP6230C
Jun.-2014
Email: marketing@lowpowersemi.com
www.lowpowersemi.com
Page 6 of 7
Preliminary Datasheet
LP6230C
Diode Selection
To achieve high efficiency, Schottky diode is good
choice for low forward drop voltage and fast
switching time. The output diode rating should be
able to handle the maximum output voltage, average
power dissipation and the pulsating diode peak
current.
Input Capacitor Selection
For better input bypassing, low-ESR ceramic
capacitors are recommended for performance. A
10μF input capacitor is sufficient for most
applications. For a lower output power requirement
application, this value can be decreased.
Output Capacitor Selection
For lower output voltage ripple, low-ESR ceramic
capacitors are recommended. The tantalum
capacitors can be used as well, but the ESR is bigger
than ceramic capacitor. The output voltage ripple
consists of two components: one is the pulsating
output ripple current flows through the ESR, and the
other is the capacitive ripple caused by charging and
discharging.
Layout Guideline
For high frequency switching power supplies, the
PCB layout is important step in system application
design. In order to let IC achieve good regulation,
high efficiency and stability, it is strongly
recommended the power components should be
placed as close as possible. The set races should be
wide and short. The feedback pin and then works of
feedback and compensation should keep away from
the power loops, and be shielded with a ground trace
or plane to prevent noise coupling.Input and Output
capacitors should be placed close to the IC and
connected to ground plane to reduce noise coupling.



Html Pages

1 2 3 4 5 6 7


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com