LP6303-01

Apr.-2014

www.lowpowersemi.com

Page 4 of 11

Preliminary Datasheet

LP6303

Application Circuit

LX1

FB1

LX2

FB2

LX3

FB3

VIN1

VIN2

VIN3

EN1

EN2

EN3

GND1

GND2

GND3

GND

VIN

5V

C1

10μF

C2

10μF

C3

10μF

C6

22μF

C7

22μF

C8

22μF

C10

OPTIONAL

C11

OPTIONAL

C12

OPTIONAL

L1

2.2μH

L2

2.2μH

L3

2.2μH

R1

100KΩ

R2

100KΩ

R3

100KΩ

R4

100KΩ

R5

200KΩ

R6

100KΩ

Vout3

1.8V/2A

Vout2

1.2V/2A

Vout1

1.2V/2A

ON

ON

ON

OFF

OFF

OFF

Absolute Maximum Ratings

Note 1



Input to GND(VIN) ---------------------------------------------------------------------------------------------- -0.3V to 6V



Other Pin to GND --------------------------------------------------------------------------------------------- -0.3V to 6V



Maximum Junction Temperature ---------------------------------------------------------------------------------- 150°C







Maximum Soldering Temperature (at leads, 10 sec) -------------------------------------------------------- 260°C

Note 1.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress

ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational

sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Thermal Information





ESD Susceptibility



HBM(Human Body Mode) --------------------------------------------------------------------------------------------- 2KV



MM(Machine Mode) --------------------------------------------------------------------------------------------------- 200V