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MP1470B Datasheet(PDF) 12 Page - Monolithic Power Systems |
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MP1470B Datasheet(HTML) 12 Page - Monolithic Power Systems |
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12 / 18 page ![]() MP1470B – SYNCHRONOUS, STEP-DOWN CONVERTER WITH INTERNAL MOSFETS MP1470B Rev. 1.0 www.MonolithicPower.com 12 8/25/2015 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2015 MPS. All Rights Reserved. Over-Current Protection and Hiccup Mode The MP1470B has a cycle-by-cycle over- current limit for when the inductor current peak value exceeds the set current limit threshold. When the output voltage drops to trigger a UV event (FB falls below the under-voltage (UV) threshold (typically 140mV)), the MP1470B enters hiccup mode to restart the part periodically. This protection mode is especially useful when the output is dead-shorted to ground. This greatly reduces the average short- circuit current to alleviate thermal issues and protect the regulator. The MP1470B exits hiccup mode once the over-current condition is removed. Thermal Shutdown Thermal shutdown prevents the chip from operating at exceedingly high temperatures. When the silicon die temperature exceeds 150°C, the whole chip shuts down. When the temperature falls below its lower threshold (typically 130°C), the chip is enabled again. Floating Driver and Bootstrap Charging An external bootstrap capacitor powers the floating power MOSFET driver. This floating driver has its own UVLO protection with a rising threshold of 2.2V and a hysteresis of 150mV. VIN regulates the bootstrap capacitor voltage internally through D1, M1, R4, C4, L1, and C2 (see Figure 3). If VIN-VSW exceeds 5V, U1 regulates M1 to maintain a 5V BST voltage across C4. Figure 3: Internal Bootstrap Charger Start-Up and Shutdown Circuit If both VIN and EN exceed their respective thresholds, the chip starts up. The reference block starts first, generating a stable reference voltage and currents, and then the internal regulator is enabled. The regulator provides a stable supply for the remaining circuits. Three events can shut down the chip: EN low, VIN low, and thermal shutdown. The shutdown procedure starts by initially blocking the signaling path to avoid any fault triggering. The COMP voltage and the internal supply rail are then pulled down. The floating driver is not subject to this shutdown command. |
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