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BCP040C Datasheet(PDF) 3 Page - BeRex Corporation

Part # BCP040C
Description  HIGH EFFICIENCY HETEROJUNCTION POWER FET CHIP
PDF  4 Pages
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Manufacturer  BEREX [BeRex Corporation]
Direct Link  http://www.berex.com
Logo BEREX - BeRex Corporation

BCP040C Datasheet(HTML) 3 Page - BeRex Corporation

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www.berex.com
BeRex, Inc. 3350 Scott Blvd. #6101 Santa Clara 95054 tel. (408) 452-5595
February 2017
Specifications are subject to change without notice. ©BeRex 2017
Rev. 1.1
BCP040C
S-PARAMETERS (Vds = 8V, Ids = 60mA)
FREQ.
[GHZ]
S11
[MAG]
S11
[ANG.]
S21
[MAG]
S21
[ANG.]
S12
[MAG]
S12
[ANG.]
S22
[MAG]
S22
[ANG.]
1.0
0.96
-32.77
9.22
157.08
0.019
74.39
0.75
-10.91
2.0
0.91
-62.35
8.30
137.43
0.033
58.12
0.70
-20.57
3.0
0.85
-89.11
7.32
120.10
0.044
46.81
0.65
-28.37
4.0
0.80
-113.74
6.38
105.13
0.050
37.96
0.60
-33.06
5.0
0.77
-135.76
5.56
91.69
0.054
29.52
0.56
-37.20
6.0
0.75
-155.44
4.86
79.41
0.056
23.50
0.52
-41.51
7.0
0.75
-173.01
4.28
68.68
0.056
18.04
0.49
-45.00
8.0
0.76
172.05
3.76
58.61
0.055
15.33
0.47
-47.88
9.0
0.77
158.74
3.32
48.98
0.051
10.95
0.46
-52.71
10.0
0.79
147.46
2.94
40.38
0.050
8.65
0.44
-56.78
11.0
0.81
138.51
2.61
32.53
0.049
8.67
0.42
-62.62
12.0
0.83
130.46
2.34
24.50
0.047
8.83
0.40
-68.79
13.0
0.85
123.26
2.12
17.44
0.045
4.84
0.39
-75.41
14.0
0.86
117.71
1.91
10.71
0.047
8.38
0.37
-83.12
15.0
0.88
111.89
1.73
3.69
0.047
6.82
0.36
-91.10
16.0
0.89
107.81
1.57
-2.51
0.048
5.16
0.36
-100.53
17.0
0.91
104.38
1.45
-8.61
0.050
5.99
0.36
-112.60
18.0
0.91
99.79
1.33
-15.34
0.050
5.85
0.37
-122.80
19.0
0.91
97.32
1.19
-21.75
0.053
5.47
0.39
-133.49
20.0
0.92
94.84
1.09
-27.79
0.052
3.02
0.42
-145.15
21.0
0.92
93.48
0.98
-33.30
0.055
3.69
0.45
-154.23
22.0
0.91
92.03
0.90
-38.62
0.055
3.83
0.49
-162.65
23.0
0.90
90.59
0.81
-44.51
0.058
2.69
0.53
-171.11
24.0
0.90
89.92
0.73
-49.47
0.061
0.24
0.56
-178.63
25.0
0.90
89.62
0.66
-53.64
0.057
-0.17
0.59
174.88
26.0
0.93
87.29
0.59
-58.58
0.062
6.04
0.62
168.70
Note: S-parameters include bond wires. Reference planes are at edge of substrates shown on “Wire Bonding Information” figure below.



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