LO-M67F datasheet(12/21 Pages) OSRAM

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LO-M67F Datasheet(PDF) 12 Page - OSRAM GmbH

12 / 21 page

2014-10-31

Version 1.3

LO M67F

Recommended Solder Pad 9) page 20

Reflow soldering

Empfohlenes Lötpaddesign 9) Seite 20

Reflow-Löten

Note:

For superior solder joint connectivity results we

recommend soldering under standard nitrogen

atmosphere. Package not suitable for ultra

sonic cleaning.

Anm.:

Um eine verbesserte Lötstellenkontaktierung zu

erreichen, empfehlen wir, unter Standard-

Stickstoffatmosphäre zu löten. Das Gehäuse ist

für Ultraschallreinigung nicht geeignet.

OHLPY978

Paddesign

for improved

heat dissipation

Cu-area > 16 mm

Cu-Fläche > 16 mm

Wärmeableitung

Padgeometrie

für verbesserte

Lötstopplack

Solder resist

0.8 (0.031)

2.8 (0.110)

0.8 (0.031)

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