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LS-Q976 Datasheet(PDF) 11 Page - OSRAM GmbH |
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LS-Q976 Datasheet(HTML) 11 Page - OSRAM GmbH |
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11 / 19 page ![]() Version 1.2 LS Q976 2014-06-04 11 Recommended Solder Pad 9) page 19 Reflow soldering Empfohlenes Lötpaddesign 9) Seite 19 Reflow-Löten Note: For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. Anm.: Um eine verbesserte Lötstellenkontaktierung zu erreichen, empfehlen wir, unter Standard- Stickstoffatmosphäre zu löten. Das Gehäuse ist für Ultraschallreinigung nicht geeignet. 0.8 (0.031) 0.7 (0.028) OHAPY606 0.8 (0.031) |
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