ICM7211AMLPL datasheet(3/9 Pages) RENESAS

3 / 9 page

ICM7211AM

FN3158 Rev 8.00

Page 3 of 9

October 22, 2015

Absolute Maximum Ratings

Thermal Information

Supply Voltage (VDD - VSS) . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.5V

Input Voltage (Any Terminal) (Note 1) . . . VSS - 0.3V to VDD, + 0.3V

Operating Conditions

Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to 85°C

Thermal Resistance (Typical, Note 2)

JA (°C/W)

PDIP Package* . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MQFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150°C

Maximum Storage Temperature Range . . . . . . . . .-65×°C to 150°C

Maximum Lead Temperature (Soldering, 10s) . . . . . . . . . . . . 300°C

*Pb-free PDIPs can be used for through hole wave solder process-

ing only. They are not intended for use in Reflow solder processing

applications.

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the

device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTES:

1. Due to the SCR structure inherent in the CMOS process, connecting any terminal to voltages greater than VDD or less than VSS may cause

destructive device latchup. For this reason, it is recommended that no inputs from external sources not operating on the same power supply be

applied to the device before its supply is established, and that in multiple supply systems, the supply to the ICM7211AM be turned on first.

JA is measured with the component mounted on an evaluation PC board in free air.

Electrical Specifications

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNITS

CHARACTERISTICS

VDD = 5V 10%, TA = 25°C, VSS = 0V Unless Otherwise Specified

Operating Supply Voltage Range (VDD - VSS), VSUPPLY

356

Operating Current, IDD

Test circuit, Display blank

A

Oscillator Input Current, IOSCI

Pin 36

2

10

A

Segment Rise/Fall Time, tr, tf

CL = 200pF

0.5

s

Backplane Rise/Fall Time, tr, tf

CL = 5000pF

1.5

s

Oscillator Frequency, fOSC

Pin 36 Floating

kHz

Backplane Frequency, fBP

Pin 36 Floating

150

INPUT CHARACTERISTICS

Logical “1” Input Voltage, VIH

Logical “0” Input Voltage, VIL

Input Leakage Current, IILK

Pins 27-34

0.01

1

A

Input Capacitance, ClN

Pins 27-34

BP/Brightness Input Leakage, IBPLK

Measured at Pin 5 with Pin 36 at VSS

0.01

1

A

BP/Brightness Input Capacitance, CBPI

All Devices

200

AC CHARACTERISTICS

Chip Select Active Pulse Width, tWL

Other Chip Select Either Held Active, or

Both Driven Together

200

Data Setup Time, tDS

100

Data Hold Time, tDH

Inter-Chip Select Time, tICS

s

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