ISL9212B

FN6399 Rev 0.00

Page 11 of 11

March 21, 2007

Thin Dual Flat No-Lead Plastic Package (TDFN)

C

//

L

C

e

TERMINAL TIP

FOR EVEN TERMINAL/SIDE

NX (b)

SECTION "C-C"

5

(A1)

BOTTOM VIEW

A

6

AREA

INDEX

C

0.10

0.08

SIDE VIEW

0.15

2X

E

A

B

C

0.15

D

TOP VIEW

CB

2X

6

8

AREA

INDEX

NX L

E2

E2/2

REF.

e

N

(Nd-1)Xe

(DATUM A)

(DATUM B)

5

0.10

8

7

D2

B

A

M C

N-1

12

PLANE

SEATING

C

A

A3

NX b

D2/2

NX k

L

L12.4x3A

12 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE

(COMPLIANT TO JEDEC MO-229-WGED-4 ISSUE C)

SYMBOL

MILLIMETERS

NOTES

MIN

NOMINAL

MAX

A

0.70

0.75

0.80

-

A1

-

-

0.05

-

A3

0.20 REF

-

b

0.18

0.23

0.30

5,8

D

4.00 BSC

-

D2

3.15

3.30

3.40

7,8

E

3.00 BSC

-

E2

1.55

1.70

1.80

7,8

e

0.50 BSC

-

k0.20

-

-

-

L

0.30

0.40

0.50

8

N12

2

Nd

6

3

Rev. 0 1/06

NOTES:

1. Dimensioning and tolerancing conform to ASME Y14.5-1994.

2. N is the number of terminals.

3. Nd refers to the number of terminals on D.

4. All dimensions are in millimeters. Angles are in degrees.

5. Dimension b applies to the metallized terminal and is measured

between 0.15mm and 0.30mm from the terminal tip.

6. The configuration of the pin #1 identifier is optional, but must be

located within the zone indicated. The pin #1 identifier may be

either a mold or mark feature.

7. Dimensions D2 and E2 are for the exposed pads which provide

improved electrical and thermal performance.

8. Nominal dimensions are provided to assist with PCB Land

Pattern Design efforts, see Intersil Technical Brief TB389.