HIP6004E

FN4997 Rev 3.00

Page 2 of 14

November 10, 2015

Typical Application

Ordering Information

PART NUMBER

PACKAGE

PKG. DWG. #

HIP6004ECBZ

(See Note)

0 to 70

20 Ld SOIC

(Pb-free)

M20.3

HIP6004ECVZ

(See Note) No longer available or

supported, recommended replacement

HIP6004ECBZ

0 to 70

20 Ld TSSOP

(Pb-free)

M20.173

*Add “-T” suffix to part number for tape and reel packaging.

NOTE: Intersil Pb-free products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which is compatible with

both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of

IPC/JEDEC J Std-020B.

+12V

PGND

HIP6004E

VSEN

RT

FB

COMP

VID25mV

VID0

VID1

VID2

SS

PGOOD

D/A

GND

OSC

LGATE

UGATE

OCSET

PHASE

BOOT

VCC

OVP

MONITOR AND

PROTECTION

+

-

+

-

VID3