HIN232 datasheet(21/22 Pages) RENESAS

21 / 22 page

HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241

FN3138 Rev 17.00

Page 21 of 22

August 6, 2015

Shrink Small Outline Plastic Packages (SSOP)

NOTES:

1. Symbols are defined in the “MO Series Symbol List” in Section 2.2

of Publication Number 95.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate

burrs. Mold flash, protrusion and gate burrs shall not exceed

0.20mm (0.0078 inch) per side.

4. Dimension “E” does not include interlead flash or protrusions.

Interlead flash and protrusions shall not exceed 0.20mm (0.0078

inch) per side.

5. The chamfer on the body is optional. If it is not present, a visual

index feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. Dimension “B” does not include dambar protrusion. Allowable

dambar protrusion shall be 0.13mm (0.005 inch) total in excess of

“B” dimension at maximum material condition.

10. Controlling dimension: MILLIMETER. Converted inch dimensions

are not necessarily exact.

INDEX

AREA

-B-

0.25(0.010)

C A

-A-

-C-

SEATING PLANE

0.10(0.004)

0.25(0.010)



0.25

0.010

GAUGE

PLANE

M28.209 (JEDEC MO-150-AH ISSUE B)

28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

0.078

2.00

0.002

0.05

0.065

0.072

1.65

1.85

0.009

0.014

0.22

0.38

0.004

0.009

0.09

0.25

0.390

0.413

9.90

10.50

0.197

0.220

5.00

5.60

0.026 BSC

0.65 BSC

0.292

0.322

7.40

8.20

0.022

0.037

0.55

0.95

N28



0°

8°

0°

8°

Rev. 2 6/05

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