2 /4

Isabellenhütte Heusler GmbH & Co. KG // sales.components@isabellenhuette.de // Issue 31-March-2017

BVF // Size 1213

Recommended solder profile

Reflow- and IR-soldering

Temperature

°C

260

255

217

Time

sec

peak

40

90

Tape and reel information

Specification

DIN EN 60286-3

Tape width

mm

12

Parts per reel

pcs

5000

Specification

Parameters

Test conditions

Specified values

Temperature Cycling

2000 cycles (-55 °C to +150 °C)

±1.0 %

Low Temperature Storage and Operation

-65 °C for 250 h

±0.1 %

Resistance to Soldering Heat

260 °C for 10 sec / 8h steam aging

n.a.

Moisture Resistance

MIL-STD-202 method 106

±0.2 %

Mechanical Shock

100 g, 6 ms half sine

±0.2 %

Vibration, High Frequency

10 g, 10-2000 Hz

±0.2 %

Operational Life

High Temperature Exposure

2000 h / 175 °C

±1.0 %

Bias Humidity

+85 °C, 85 r.F., 1000 h

±0.5 %

Power derating curve: 110 °C / 145 °C

Stability <1.0 %

Improved stability <0.5 %

0

0,25

0,5

0,75

1

1,25

0

20

40

60

80

100

120

140

160

180

Temperature dependence of the electrical resistance

of BVF-V-R001

dR/R20 [%]

-1,25

-1,00

-0,75

-0,50

-0,25

0,00

0,25

0,50

0,75

1,00

-60

-40

-20

0

20

40

60

80

100

120

140

160

180

TCR = 35 ppm/K

TCR = - 0ppm/K

TCR = 70 ppm/K

Temperature [°C]