AD8319ACPZ-R2 datasheet(19/19 Pages) AD

19 / 19 page

Data Sheet

AD8319

Rev. D | Page 19 of 19

OUTLINE DIMENSIONS

SEATING

PLANE

0.30

0.23

0.18

0.203 REF

0.80

0.75

0.70

1.89

1.74

1.59

0.50 BSC

0.20 MIN

0.60

0.45

0.30

0.55

0.40

0.30

BOTTOM VIEW

3.25

3.00

2.75

2.25

2.00

1.75

TOP VIEW

0.05 MAX

0.02 NOM

EXPOSED PAD

PIN 1 INDEX

AREA

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

Figure 39. 8-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 2 mm Body and 0.75 mm Package Height

(CP-8-23)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

Branding

AD8319ACPZ-R7

–40°C to +85°C

8-Lead LFCSP

CP-8-23

AD8319ACPZ-R2

–40°C to +85°C

8-Lead LFCSP

CP-8-23

AD8319ACPZ-WP

–40°C to +85°C

8-Lead LFCSP, Waffle Pack

CP-8-23

AD8319-EVALZ

Evaluation Board

Z = RoHS Compliant Part.

registered trademarks are the property of their respective owners.

D05705-0-9/17(D)

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