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X9259 Datasheet(PDF) 21 Page - Renesas Technology Corp |
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X9259 Datasheet(HTML) 21 Page - Renesas Technology Corp |
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21 / 21 page ![]() X9259 FN8169 Rev 6.00 Page 21 of 21 December 12, 2014 Package Outline Drawing M24.173 24 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP) Rev 1, 5/10 DETAIL "X" TYPICAL RECOMMENDED LAND PATTERN TOP VIEW SIDE VIEW END VIEW Dimension does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 per side. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25 per side. Dimensions are measured at datum plane H. Dimensioning and tolerancing per ASME Y14.5M-1994. Dimension does not include dambar protrusion. Allowable protrusion shall be 0.08mm total in excess of dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm. Dimension in ( ) are for reference only. Conforms to JEDEC MO-153. 6. 3. 5. 4. 2. 1. NOTES: 7. 5 SEATING PLANE C H 3 2 1 24 B 12 1 3 13 A PLANE GAUGE 0.05 MIN 0.15 MAX 0°-8° 0.60± 0.15 0.90 1.00 REF 0.25 SEE DETAIL "X" 0.15 0.25 (0.65 TYP) (5.65) (0.35 TYP) (1.45) 6.40 4.40 ±0.10 0.65 1.20 MAX PIN #1 I.D. MARK 7.80 ±0.10 +0.05 -0.06 -0.06 +0.05 -0.10 +0.15 0.20 C B A 0.10 C - 0.05 0.10 C B A M |
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