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QPI-4L Data Sheet Rev. 3.0 Page 2 of 8

Pins

Parameter

Notes

Min

Max

Units

BUS+ to BUS-

Input voltage

Continuous

-80

80

Vdc

BUS+ to BUS-

Input voltage

100ms transient

-100

100

Vdc

BUS+/BUS- to Shield Plane

BUS inputs to Shield Hipot

Per test std.

+/-1500

Vdc

QPI+ to QPI-

Input to output current

10 seconds @ 25°C

10

Adc

Package

Power dissipation

2.0

W

Package

Operating temperature

PCB to QPI Interface

-40

100

°C

Package

Thermal resistance

Free air

50

°C/W

Package

Junction temperature

Internal @ Pdmax and 15°C/W

130

°C

Package

Thermal resistance

PCB layout (see Figs. 9 & 10)

1

15

°C/W

Package

Storage temperature

-40

125

°C

Package

Re-flow temperature

20 second exposure @

212

°C

All Pins

ESD

HBM

+/-2

kV

Parameter

Notes

Min

Typ

Max

Units

BUS+ to BUS- input range

30

80

Vdc

BUS+ to QPI+ voltage drop

-120

mVdc

BUS- to QPI- voltage drop

30

mVdc

Common-mode insertion loss

42

dB

Differential-mode insertion loss

72

dB

Input bias current at 80 Volts

Input current from BUS+ to BUS-

8

mA

Note 1 - Refer to Figures 9 & 10 for PCB layout guidelines to achieve this thermal resistance when re-flowed onto the PCB.

Pad Designations

BUS+

BUS-

QPI+

QPI-

THERM 1

SHIELD

THERM 2

12,13,14

1,15,16

7,8,9

2,3,4

10

5,6

11

BUS-

BUS+

QPI+

SHIELD

7

8

911

12

13

16

10

14

15

1

2

3

4

5

6

QPI-

Pad Description

BUS-

Negative bus potential

BUS+

Positive bus voltage

QPI-

Negative input to the converter

QPI+

Positive input to the converter

THERM1

Internal connection must be electrically

THERM2

floating but maximize copper landing

for heat sinking.

Shield

The shield connects to the converter

shield and Y capacitor common point

through RY.

Note 2 - Refer to Figure 5 for current derating curve.

QPI-4: (bottom view)