FDC6331L datasheet(2/4 Pages) ONSEMI

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Electrical Characteristics

A = 25°C unless otherwise noted

Symbol

Parameter

Test Conditions

Min

Typ

Max

Units

Off Characteristics

BVIN

Vin Breakdown Voltage

VON/OFF = 0 V, ID = –250 A8

ILoad

Zero Gate Voltage Drain Current

VIN = 6.4 V,

VON/OFF = 0 V

–1

IFL

Leakage Current, Forward

VON/OFF = 0 V, VIN = 8 V

–100

IRL

Leakage Current, Reverse

VON/OFF = 0 V, VIN = –8 V

100

On Characteristics

(Note 2)

VON/OFF (th)

Gate Threshold Voltage

VIN = VON/OFF, ID = –250 A

0.4

0.9

1.5

RDS(on)

Static Drain–Source

On–Resistance (Q2)

VGS = –4.5 V,

ID = –2.8A

VGS = –2.5 V,

ID = –2.5 A

VGS = –1.8 V,

ID = –2.0 A

100

RDS(on)

Static Drain–Source

On–Resistance (Q1)

VGS = 4.5 V,

ID = 0.4A

VGS = 2.7 V,

ID = 0.2 A

3.1

3.8

Drain–Source Diode Characteristics and Maximum Ratings

Maximum Continuous Drain–Source Diode Forward Current

–0.6

VSD

Drain–Source Diode Forward

Voltage

VON/OFF = 0 V, IS = –0.6 A (Note 2)

–1.2

Notes:

1. R JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting

surface of the drain pins. R JC is guar anteed by design while R JA is determined by the user’s board design.

2. Pulse Test: Pulse Width < 300μs, Duty Cycle < 2.0%.

FDC6331L Load Switch Application Circuit

OUT

ON/OFF

LOAD

External Component Recommendation:

For additional in-rush current control, R2 and C1 can be added. For more information, see application note AN1030.

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