9

1.Recommended temperature profile

Solder composition : Paste, 96.5%Sn/3.0%Ag/0.5%Cu

Note 1: Up to 2 cycles of Reflow soldering are possible under the same conditions,

provided that there is a return to normal temperature between the first and

second cycle.

Note 2: The temperature profile indicates the board surface temperature at the point

of contacts with the connector terminals.

2.Recommended manual soldering

Manual soldering: 350ç for 3 seconds

Do NOT use flux compound when manual soldering.

3.Recommended screen thickness and open

area ratio (Pattern area ratio)

Standard thickness 0.1mm

Open area ratios:Lead terimnal 100%

:Ground terminal 75%

4.Board warpage

Maximum of 0.02mm at the connector center, with both ends of the connector as reference points.

5.Cleaning conditions

Refer to “Nylon Connector Use Handbook”.

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Precautions

50

60sec max

100

150

200

250

Time (sec.)

0

100

150

200

250

50

Room

temperature

300

90 to 120sec

180ç

250ç

220ç

150ç

Temperature (ç)

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Extraction tool

For details about the extraction tool, please contact your Hirose sales representative.

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.