AD8194

Data Sheet

Rev. A | Page 16 of 16

OUTLINE DIMENSIONS

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

32

9

16

17

24

25

8

EXPOSED

PAD

PIN 1

INDICATOR

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.80

0.75

0.70

0.50

0.40

0.30

0.20 MIN

2.85

2.70 SQ

2.55

COMPLIANT TO JEDEC STANDARDS MO-220-WHHD-2.

Figure 27. 32-Lead Lead Frame Chip Scale Package [LFCSP]

5 mm × 5 mm Body and 0.75 mm Package Height

(CP-32-21)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature

Range

Package Description

Package

Option

Ordering

Quantity

AD8194ACPZ

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP]

CP-32-21

AD8194ACPZ-R7

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP], Reel

CP-32-21

1,500

AD8194-EVALZ

Evaluation Board

1

Z = RoHS Compliant Part.

©2007–2017 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D07004-0-10/17(A)