ADV7481WBBCZ datasheet(13/22 Pages) AD

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Data Sheet

ADV7481

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Rating

TVDD, DVDDIO to GND

4 V

AVDD, PVDD, MVDD, DVDD, CVDD

to GND

2.2 V

CVDD to DVDD

−0.3 V to +0.3 V

MVDD to DVDD

−0.3 V to +0.3 V

PVDD to DVDD

−0.3 V to +0.3 V

AVDD to DVDD

−0.3 V to +0.3 V

Digital Inputs Voltage to GND

GND − 0.3 V to DVDDIO +

0.3 V

Digital Outputs Voltage to GND

GND − 0.3 V to DVDDIO +

0.3 V

Analog Inputs to GND

−0.3 V to AVDD + 0.3 V

XTALN and XTALP to GND

−0.3 V to PVDD + 0.3 V

HDMI/MHL Digital Inputs Voltage

to GND

−0.3 V to CVDD + 0.3 V

5 V Tolerant Inputs Voltage to

GND1, 2

−0.3 V to +5.5 V

Maximum Junction Temperature

(TJ max)

125°C

Storage Temperature Range

−65°C to +150°C

Infrared Reflow Soldering

(20 sec)

260°C

The following inputs are 3.3 V inputs but are 5 V tolerant:

DDC_SCL/CD_PULLUP, DDC_SDA, HPD/CBUS, RX_5V/VBUS, CD_SENSE and

CEC.

The following inputs are 1.8 V inputs but are 5 V tolerant: DIAG1, DIAG2,

DIAG3, and DIAG4.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

To reduce power consumption when using the ADV7481, turn

off unused sections of the device.

Due to printed circuit board (PCB) metal variation, and,

therefore, variation in PCB heat conductivity, the value of θJA

may differ for various PCBs.

The most efficient measurement solution is achieved using the

package surface temperature to estimate the die temperature.

This eliminates the variance associated with the θJA value.

Do not exceed the maximum junction temperature (TJ max) of

125°C. The following equation calculates the junction

temperature (TJ) using the measured package surface

temperature and applies only when no heat sink is used on the

device under test (DUT):

TJ = TS + (ΨJT ×WTOTAL)

where:

TS is the package surface temperature (°C).

ΨJT = 0.81°C/W for the 100-ball CSP_BGA (based on 2s2p test

board defined by JEDEC standards.

WTOTAL = (PVDD × IPVDD) + (TVDD × ITVDD) − PUpStream +

(CVDD × ICVDD) + (AVDD × IAVDD) + (DVDD × IDVDD) +

(DVDDIO × IDVDDIO) + (MVDD × IMVDD)

where PUpStream is the quantity of TVDD power consumed on the

upstream HDMI or MHL transmitter. PUpStream can be estimated

to be around 110 mW for a nominal HDMI transmitter. PUpStream

can be estimated to be around 42.82 mW for a nominal MHL

transmitter.

ESD CAUTION

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