© 2005 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FSA2467 Rev. 1.0.8

10

Package Dimensions

RECOMMENDED

LAND PATTERN

NOTES:

A. PACKAGE DOES NOT FULLY CONFORM TO

JEDEC STANDARD.

B. DIMENSIONS ARE IN MILLIMETERS.

C. DIMENSIONS AND TOLERANCES PER

ASME Y14.5M, 1994.

D. LAND PATTERN RECOMMENDATION IS

BASED ON FSC DESIGN ONLY.

E. DRAWING FILENAME: MKT-UMLP16Arev4.

F. TERMINAL SHAPE MAY VARY ACCORDING

TO PACKAGE SUPPLIER, SEE TERMINAL

SHAPE VARIANTS.

SCALE : 2X

LEAD

OPTION 1

SCALE : 2X

LEAD

OPTION 2

PIN#1 IDENT

PIN#1 IDENT

PACKAGE

EDGE

TOP VIEW

BOTTOM VIEW

0.10 C

0.08 C

2.60

1.80

0.10 C

2X

2X

SIDE VIEW

0.10 C

0.05

0.00

0.10 C A B

0.05 C

0.55 MAX.

0.40

1

5

9

13

16

2.10

2.90

0.40

0.663

0.563

0.225

1

(15X)

(16X)

0.152

0.40

0.60

0.10

0.30

0.50

0.10

TERMINAL SHAPE VARIANTS

0.15

0.25

15X

PIN 1

NON-PIN 1

0.15

0.25

15X

0.30

0.50

0.15

0.25

0.30

0.50

0.15

0.25

15X

15X

Supplier 1

Supplier 2

PIN 1

NON-PIN 1

A

B

C

SEATING

PLANE

0.45

0.35

0.55

0.45

0.25

0.15

R0.20

Figure 16.

16-Lead, Ultrathin Molded Leadless Package (UMLP)

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. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,

specifically the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/.