CS45-16io1R

Die konvexe Form des Substrates ist typ. < 0.04 mm über der

Kunststoffoberfläche der Bauteilunterseite

The convex bow of substrate is typ. < 0.04 mm over plastic

surface level of device bottom side

Die Gehäuseabmessungen entsprechen dem Typ TO-247 AD

This drawing will meet all dimensions requiarement of JEDEC

min

max

min

max

A

4.83

5.21

0.190

0.205

A1

2.29

2.54

0.090

0.100

A2

1.91

2.16

0.075

0.085

b

1.14

1.40

0.045

0.055

b2

1.91

2.20

0.075

0.087

b4

2.92

3.24

0.115

0.128

c

0.61

0.83

0.024

0.033

D

20.80

21.34

0.819

0.840

D1

15.75

16.26

0.620

0.640

D2

1.65

2.15

0.065

0.085

D3

20.30

20.70

0.799

0.815

E

15.75

16.13

0.620

0.635

E1

13.21

13.72

0.520

0.540

e

5.45 BSC

0.215 BSC

L

19.81

20.60

0.780

0.811

L1

3.81

4.38

0.150

0.172

Q

5.59

6.20

0.220

0.244

R

4.25

5.50

0.167

0.217

W

-

0.10

-

0.004

Dim.

Millimeter

Inches

E

1

2

3

3x b

2x b2

b4

W

A

A2

c

A1

2x e

E1

2

1

3

Outlines

ISOPLUS247

IXYS reserves the right to change limits, conditions and dimensions.

20150827d

Data according to IEC 60747and per semiconductor unless otherwise specified

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