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IN-C33ATN Datasheet(PDF) 3 Page - Inolux Corporation |
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IN-C33ATN Datasheet(HTML) 3 Page - Inolux Corporation |
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3 / 16 page ![]() IN-C33ATN / IN-C33BTN / IN-C33CTN UV Series 3535 UV LED Sept. 4, 2018 www.inolux-corp.com Page 3 Inolux Corporation Proprietary & Confidential Absolute Maximum Rating at 25oC Characteristics Symbol Min. Typical Max. Unit DC Forward Current1 IF 500 1000 mA Pulse Current (@1/10 duty) 2 IP 1500 mA Forward Voltage VF 3.2 3.8 V Reverse Voltage VR -5 V Leakage Current (5V) IR 10 μA Junction Temperature3 Tj 150 ℃ Operating Temperature Range Topr -40 - 125 ℃ Storage Temperature Range Tstg -40 - 125 ℃ Soldering Temperature Tsol 260 ℃ Thermal Resistance Junction / Solder Point Rth 4.5 ℃ /W Viewing Angle4 2θ1/2 30/60/120 Deg Notes: 1. When operating at other than ambient temperature, maximum allowable current depends on derating curves. 2. Pulse width = 0.01s & duty factor = 1/10. 3. When operating at maximum allowable current, Tj must be below 150 ℃. 4. Viewing angle tolerance is ± 10°. Electrical Characteristics T A = 25°C (Note 1) Product VF(V)@500mA Viewing Angle IR(μA)@VR=5V min typ max 2θ1/2 max IN-C33ATN UV Series IN-C33BTN UV Series IN-C33CTN UV Series 3.2 --- 3.8 30/60/120 10 Notes: 1. Performance guaranteed only under conditions listed in above tables. ESD Precaution ATTENTION: Electrostatic Discharge (ESD) protection The symbol above denotes that ESD precaution is needed. ESD protection for GaP and AlGaAs based chips is necessary even though they are relatively safe in the presence of low static-electric discharge. Parts built with AlInGaP, GaN, or/and InGaN based chips are STATIC SENSITIVE devices. ESD precaution must be taken during design and assembly. If manual work or processing is needed, please ensure the device is adequately protected from ESD during the process. Please be advised that normal static precautions should be taken in the handling and assembly of this device to prevent damage or degradation which may be induced by electrostatic discharge (ESD). |
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