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PAM8620 Datasheet(PDF) 2 Page - Diodes Incorporated

Part # PAM8620
Description  15W STEREO CLASS-D AUDIO POWER AMPLIFIER WITH POWER LIMIT
PDF  13 Pages
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

PAM8620 Datasheet(HTML) 2 Page - Diodes Incorporated

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PAM8620
Document number: DSxxxxx Rev. 1 - 0
2 of 13
www.diodes.com
June 2013
© Diodes Incorporated
PAM8620
A Product Line of
Diodes Incorporated
Pin Descriptions
Pin Number
Package Name
Function
1, 8, 17, 24
NC
Not Connected
2
RINN
Negative differential audio input for right channel.
3
RINP
Positive differential audio input for right channel.
4
MUTE
A logic high on this pin disables the outputs and a logic low enables the outputs.
5
AVDD
5V Analog Supply
6
LINP
Positive differential audio input for left channel.
7
LINN
Negative differential audio input for left channel.
9, 16
PGNDL
Power ground for left channel H-bridge.
10, 15
PVCCL
Power supply for left channel H-bridge, not connected to PVCCR or AVCC.
11
LOUTN
Class-D 1/2-H-bridge negative output for left channel.
12
BSLN
Bootstrap I/O for left channel, negative high-side FET.
13
BSLP
Bootstrap I/O for left channel, positive high-side FET.
14
LOUTP
Class-D 1/2-H-bridge positive output for left channel.
18
PL
Reference voltage for power limit function.
19
V2P5
2.5V Reference for analog cells.
20
AGND
Analog Ground
21
VCLAMP
Internally generated voltage supply for bootstrap capacitors.
22
AVCC
High-voltage analog power supply (8V to 26V)
23
SD
Shutdown signal for IC (low= shutdown, high =operational). TTL logic levels
with compliance to VCC.
25, 32
PGNDR
Power ground for right channel H-bridge.
26, 31
PVCCR
Power supply for right channel H-bridge, not connected to PVCCL or AVCC.
27
ROUTP
Class-D 1/2-H-bridge positive output for right channel.
28
BSRP
Bootstrap I/O for right channel, positive high-side FET.
29
BSRN
Bootstrap I/O for right channel, negative high-side FET.
30
ROUTN
Class-D 1/2-H-bridge negative output for right channel.
33
Thermal Pad
Connect to ground. Thermal pad should be soldered down on all
applications to secure the device properly to the printed wiring board.



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