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NSSM313AT Datasheet(PDF) 21 Page - NICHIA CORPORATION

Part # NSSM313AT
Description  FULL COLOR LED
PDF  23 Pages
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Manufacturer  NICHIA [NICHIA CORPORATION]
Direct Link  http://www.nichia.co.jp
Logo NICHIA - NICHIA CORPORATION

NSSM313AT Datasheet(HTML) 21 Page - NICHIA CORPORATION

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NICHIA STS-DA1-4782E <Cat.No.180209>
20
(3) Handling Precautions
● Do not handle the LEDs with bare hands as it will contaminate the LED surface and may affect the optical characteristics: it might
cause the LED to be deformed and/or the wire to break, which will cause the LED not to illuminate. The lead could also cause an
injury.
● Ensure that when handling the LEDs with tweezers, excessive force is not applied to the LED. Otherwise, it may cause damage to
the resin (e.g. cut, scratch, chip, crack, delamination and deformation) and the wire to break causing a catastrophic failure (i.e.
the LED not to illuminate).
● Dropping may cause damage to the LED (e.g. deformation).
● Do not stack assembled PCBs together. Otherwise, it may cause damage to the resin (e.g. cut, scratch, chip, crack, delamination
and deformation) and the wire to break causing a catastrophic failure (i.e. the LED not to illuminate).
● The encapsulating resin is tacky. Ensure that foreign substances do not adhere to this surface; it will contaminate the surface and
may affect the optical characteristics.
(4) Design Consideration
● If the LEDs are soldered to a PCB and the PCB assembly is bent (e.g. PCB depaneling process), it may cause the LED package to
break. The PCB layout should be designed to minimize the mechanical stress on the LEDs when the PCB assembly is bent/warped.
● The amount of mechanical stress exerted on the LED from depaneling may vary depending on the LED position/orientation on the
PCB assembly (e.g. especially in areas near V-groove scores). The PCB layout should be designed to minimize the mechanical
stress on the LEDs when the PCB is separated into individual PCB assemblies.
● To separate a PCB populated with the LEDs, use a specially designed tool. Do not break the PCB by hand.
● Volatile organic compounds that have been released from materials present around the LEDs (e.g. housing, gasket/seal, adhesive,
secondary lens, lens cover, etc.) may penetrate the LED lens and/or encapsulating resin. If the LEDs are being used in a
hermetically sealed environment, these volatile compounds can discolor after being exposed to heat and/or photon energy and
it may greatly reduce the LED light output and/or color shift. In this case, ventilating the environment may improve the reduction
in light output and/or color shift. Perform a light-up test of the chosen application for optical evaluation to ensure that there are
no issues, especially if the LEDs are planned to be used in a hermetically sealed environment.
(5) Electrostatic Discharge (ESD)
● This LED is sensitive to transient excessive voltages (e.g. ESD, lightning surge). If this excessive voltage occurs in the circuit, it
may cause the LED to be damaged causing issues (e.g. the LED to become dimmer or not to illuminate [i.e. catastrophic failure]).
Ensure that when handling the LEDs, necessary measures are taken to protect them from an ESD discharge. The following
examples are recommended measures to eliminate the charge:
- Grounded wrist strap, ESD footwear, clothes, and floors
- Grounded workstation equipment and tools
- ESD table/shelf mat made of conductive materials
● Ensure that all necessary measures are taken to prevent the LEDs from being exposed to transient excessive voltages (e.g. ESD,
lightning surge):
- tools (e.g. soldering irons), jigs, and machines that are used are properly grounded
- appropriate ESD materials/equipment are used in the work area
- the system/assembly is designed to provide ESD protection for the LEDs.
● If the tool/equipment used is an insulator (e.g. glass cover, plastic, etc.), ensure that necessary measures have been taken to
protect the LED from transient excessive voltages (e.g. ESD). The following examples are recommended measures to eliminate
the charge:
- Dissipating static charge with conductive materials
- Preventing charge generation with moisture
- Neutralizing the charge with ionizers
● To detect if an LED was damaged by transient excess voltages (i.e. an ESD event during the system’s assembly process), perform
a characteristics inspection (e.g. forward voltage measurement, light-up test) at low current (≤1mA).
● LEDs with ESD-damaged dice (i.e. other than red) may have a current flow at a low voltage, or no longer illuminate at a low
current.
Failure Criteria: VF<2.0V at IF=0.5mA



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