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LTC3776EUF Datasheet(PDF) 21 Page - Linear Technology |
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LTC3776EUF Datasheet(HTML) 21 Page - Linear Technology |
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21 / 28 page ![]() 21 LTC3776 3776f APPLICATIO S I FOR ATIO determine the loop feedback factor gain and phase. An output current pulse of 20% to 100% of full load current having a rise time of 1µs to 10µs will produce output voltage and ITH pin waveforms that will give a sense of the overall loop stability. The gain of the loop will be increased by increasing RC, and the bandwidth of the loop will be increased by decreasing CC. The output voltage settling behavior is related to the stability of the closed-loop system and will demonstrate the actual overall supply performance. For a detailed explanation of optimizing the compensation components, including a review of control loop theory, refer to Application Note 76. A second, more severe transient is caused by switching in loads with large (>1µF) supply bypass capacitors. The discharged bypass capacitors are effectively put in parallel with COUT, causing a rapid drop in VOUT. No regulator can deliver enough current to prevent this problem if the load switch resistance is low and it is driven quickly. The only solution is to limit the rise time of the switch drive so that the load rise time is limited to approximately (25)(CLOAD). Thus a 10µF capacitor would require a 250µs rise time, limiting the charging current to about 200mA. PC Board Layout Checklist When laying out the printed circuit board, the following checklist should be used to ensure proper operation of the LTC3776. These items are illustrated in the layout diagram of Figure 12. Figure 13 depicts the current waveforms present in the various branches of the 2-phase dual regulator. 1) The power loop (input capacitor, MOSFETs, inductor, output capacitor) of each channel should be as small as possible and isolated as much as possible from the power loop of the other channel. Ideally, the drains of the P- and N-channel FETs should be connected close to one another with an input capacitor placed across the FET sources (from the P-channel source to the N-channel source) right at the FETs. It is better to have two separate, smaller valued input capacitors (e.g., two 10µF—one for each channel) than it is to have a single larger valued capacitor (e.g., 22µF) that the channels share with a common connection. 2) The signal and power grounds should be kept separate. The signal ground consists of the feedback resistor dividers, ITH compensation networks and the SGND pin. The power grounds consist of the (–) terminal of the input and output capacitors and the source of the N-channel MOSFET. Each channel should have its own power ground for its power loop (as described in (1) above). The power grounds for the two channels should connect together at a common point. It is most important to keep the ground paths with high switching currents away from each other. The PGND pins on the LTC3776 IC should be shorted together and connected to the common power ground connection (away from the switching currents). 3) Put the feedback resistors close to the VFB pins. The trace connecting the top feedback resistor (RB) to the output capacitor should be a Kelvin trace. The ITHcompen- sation components should also be very close to the LTC3776. 4) The current sense traces (SENSE+ and SW) should be Kelvin connections right at the P-channel MOSFET source and drain. 5) Keep the switch nodes (SW1, SW2) and the gate driver nodes (TG1, TG2, BG1, BG2) away from the small-signal components, especially the opposite channels feedback resistors, ITH compensation components and the current sense pins (SENSE+ and SW). SW1 IPRG1 VFB1 ITH1 IPRG2 PLLLPF SGND VIN VREF VFB2 ITH2 PGOOD SENSE1+ PGND BG1 SYNC/SSEN TG1 PGND TG2 RUN/SS BG2 PGND SENSE2+ SW2 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 LTC3776EGN COUT1 COUT2 CVIN1 CVIN VOUT1 VOUT2 BOLD LINES INDICATE HIGH CURRENT PATHS 3776 F12 L1 L2 MN1 MP1 MN2 MP2 VIN CVIN2 Figure 12. LTC3776 Layout Diagram |
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