AP65251

Document number: DS36109 Rev. 1 - 2

13 of 19

www.diodes.com

October 2017

© Diodes Incorporated

AP65251

PACKAGE INFORMATION

Mechanical Data



Surface Mount Package



Case Material: Molded Plastic, UL Flammability Classification

Rating 94V-0



Terminals: Finish

– Matte Tin Plated Leads, Solderable per

MIL-STD-202, Method 208



Weight: 0.013 grams (Approximate)



Max Soldering Temperature +260°C for 30 secs as per JEDEC

J-STD-020

Package View

Package Outline Dimensions

TSOT26

TSOT26

Dim

Min

Max

Typ

A



1.00



A1

0.010

0.100



A2

0.840

0.900



D

2.800

3.000

2.900

E

2.800 BSC

E1

1.500

1.700

1.600

b

0.300

0.450



c

0.120

0.200



e

0.950 BSC

e1

1.900 BSC

L

0.30

0.50



L2

0.250 BSC

θ

0°

8°

4°

θ1

4°

12°



All Dimensions in mm

Suggested Pad Layout

TSOT26

Dimensions

Value (in mm)

C

0.950

X

0.700

Y

1.000

Y1

3.199

Note:

The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These

dimensions may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering

and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for

Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Note:

For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance distances

between device Terminals and PCB tracking.

D

E1

E1/2

e1

E

E/2

e

A

A2

A1

Seating Plane

0

L2

L

Gauge Plane

01(4x)

01(4x)

c

b

Seating Plane

Y1

C

X

Y

Top View

e3