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SSPS7331P-C Datasheet(PDF) 1 Page - SeCoS Halbleitertechnologie GmbH |
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SSPS7331P-C Datasheet(HTML) 1 Page - SeCoS Halbleitertechnologie GmbH |
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1 / 4 page ![]() Elektronische Bauelemente SSPS7331P-C -13.4 A , -30 V , RDS(ON) 13 mΩ Ω Ω Ω P-Ch Enhancement Mode Power MOSFET 13-Dec-2017 Rev. C Page 1 of 4 http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually. 311 RoHS Compliant Product A suffix of “-C” specifies halogen & lead-free FEATURES Low RDS(on) provides higher efficiency and extends battery life Low thermal impedance copper leadframe DFN3x3-8PP saves board space Fast switching speed High performance trench technology APPLICATION DC-DC converters and power management in portable and battery-powered products such as computers, printers, PCMCIA cards, cellular and cordless telephones. MARKING PACKAGE INFORMATION Package MPQ Leader Size DFN3x3-8PP 3K 13 inch ORDER INFORMATION MAXIMUM RATINGS (T A=25°C unless otherwise specified) Parameter Symbol Ratings Unit Drain-Source Voltage VDS -30 V Gate-Source Voltage VGS ±20 V TA = 25°C -13.4 A Continuous Drain Current 1 TA = 70°C ID -10.2 A Pulsed Drain Current 2 IDM -50 A Continuous Source Current (Diode Conduction) 1 IS -4.6 A TA = 25°C 3.5 W Total Power Dissipation 1 TA = 70°C PD 2 W Operating Junction & Storage Temperature Range TJ, TSTG -55 ~ 150 °C Thermal Resistance Ratings t≦10 sec 35 °C / W Thermal Resistance Junction-Ambient (Max.) 1 Steady State RθJA 81 °C / W Notes: 1. Surface Mounted on 1” x 1” FR4 Board. 2. Pulse width limited by maximum junction temperature. Part Number Type SSPS7331P-C Lead (Pb)-free and Halogen-free DFN3x3-8PP Millimeter Millimeter REF. Min. Max. REF. Min. Max. A 3.2 3.4 G 1.78 1.98 B 3 3.2 H 0.25 0.35 C 3.25 3.45 I 0.35TYP. D 3 3.2 J 0.6TYP. E 0.65BSC. K 0.1 0.25 F 2.39 2.59 L 0.7 0.8 = Date code |
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