VL53L1 datasheet(32/35 Pages) STMICROELECTRONICS

32 / 35 page

Packaging and labeling

VL53L1X

32/35

DocID031281 Rev 3

Note:

As the VL53L1X package is not sealed, only a dry reflow process should be used (such as

convection reflow). Vapor phase reflow is not suitable for this type of optical component.

The VL53L1X is an optical component and as such, it should be treated carefully. This

would typically include using a ‘no-wash’ assembly process

8.6

Handling and storage precautions

8.6.1

Shock precaution

Sensor modules house numerous internal components that are susceptible to shock

damage. If a unit is subject to excessive shock, is dropped on the floor, or a tray/reel of units

is dropped on the floor, it must be rejected, even if no apparent damage is visible.

8.6.2

Part handling

Handling must be done with non-marring ESD safe carbon, plastic, or teflon tweezers.

Ranging modules are susceptible to damage or contamination. The customer is advised to

use a clean assembly process after removing the tape from the parts, and until a protective

cover glass is mounted.

8.6.3

Compression force

A maximum compressive load of 25 N should be applied on the module.

8.6.4

Moisture sensitivity level

Moisture sensitivity is level 3 (MSL) as described in IPC/JEDEC JSTD-020-C

8.7

Storage temperature conditions

Table 19. Recommended storage conditions

Parameter

Min.

Typ.

Max.

Unit

Temperature (storage)

-40

°C

VL53L1 Datasheet(PDF) 32 Page - STMicroelectronics