INMP504

PCB DESIGN AND LAND PATTERN LAYOUT

The recommended PCB land pattern for the INMP504 should be laid out to a 1:1 ratio to the solder pads on the microphone

package, as shown in Figure 8. Take care to avoid applying solder paste to the sound hole in the PCB. A suggested solder paste

stencil pattern layout is shown in Figure 9. The diameter of the sound hole in the PCB should be larger than the diameter of the

sound port of the microphone. A minimum diameter of 0.5 mm is recommended.

Dimensions shown in millimeters

Figure 8. PCB Land Pattern Layout

Dimensions shown in millimeters

Figure 9. Suggested Solder Paste Stencil Pattern Layout

Ø1.55

Ø0.95

1.52

0.90

1.90

1.22

0.68

0.61

0.61

1.22

2×

0.8 × 0.6

0.2 × 45

TYP

1.52mm

1.55/1.05 DIA.

0.225 CUT WIDTH (2×)

Page 10 of 13

Document Number: DS-INMP504-00

Revision: 1.0.