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RM3182
PRODUCT SPECIFICATION
2
Pin Assignments
Absolute Maximum Ratings
Notes:
1. Heatsinking may he required for output short circuit at +125
°C.
2. Heatsinking may be required depending on load and signal frequencies
Thermal Characteristics
(Still air, soldered into PC board)
Parameter
Min.
Max.
Units
Supply Voltage (+VS to –VS)
36
V
V1 Voltage
+7
V
VREF Voltage
+6
V
Logic Input Voltage
-0.3
+VS + 0.3
V
Output Short Circuit Duration
See Note 1
Output Overvoltage
–6.5
+6.5
V
Storage Temperature Range
-65
+150
°C
Operating Temperature Range (see Note 2)
-55
+125
°C
Lead Soldering Temperature (60 sec.)
+300
°C
Sidebrazed DIP
LCC
Maximum Junction Temperature
+175
°C
+175
°C
Max. PD TA < 50
°C
1470 mW
1040 mW
Thermal Resistance
θJC
25
°C/W
25
°C/W
Thermal Resistance
θJA
85
°C/W
120
°C/W
For TA > 50
°C Derate at
11.7 mW/
°C
8.3 mW/
°C
V1
NC
Clock
Data (B)
CB
BOUT
NC
+VS
1
2
3
4
5
6
7
8
VREF
PWR Enable
Sync
Data (A)
CA
AOUT
–VS
GND
65-3182-02
16
15
14
13
12
11
10
9
Sidebraze DIP
NC
65-3182-03
1
28
Data (A)
NC
LCC
NC
CA
NC
NC
Clock
NC
Data (B)
CB
NC
NC
NC
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