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A19350LUBATN-RBE Datasheet(PDF) 1 Page - Allegro MicroSystems |
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A19350LUBATN-RBE Datasheet(HTML) 1 Page - Allegro MicroSystems |
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1 / 14 page ![]() A19350-DS MCO-0000526 • GMR technology integrates high sensitivity MR (magnetoresistive) sensor elements and high precision BiCMOS circuits on a single silicon integrated circuit, offering high accuracy, low magnetic field operation • Integrated capacitor in a single overmolded miniature package provides greater EMC robustness • SolidSpeed Digital Architecture™ supports advanced algorithms, maintaining performance in the presence of extreme system-level disturbances, including vibration immunity capability over the full target pitch • Flexible orientation for xMR or Hall replacement • ASIL B rating based on integrated diagnostics and certified safety design process • Two-wire current source output pulse-width protocol supporting speed, direction, and ASIL • EEPROM offers device traceability throughout the production process High Accuracy GMR Wheel Speed and Direction Sensor IC A19350 The A19350 is a giant magnetoresistance (GMR) integrated circuit (IC) that provides a user-friendly two-wire solution for applicationswherespeedanddirectioninformationisrequired. The small integrated package includes an integrated capacitor and GMR IC in a single overmold design with an additional molded lead-stabilizing bar for robust shipping and ease of assembly. The GMR-based IC is designed for use in conjunction with front-biased ring magnet encoders. State-of-the-art GMR technologywithindustry-leadingsignalprocessingalgorithms accuratelyswitchinresponsetolow-leveldifferentialmagnetic signals.ThehighsensitivityofGMRcombinedwithdifferential sensing offers inherent rejection of interfering common-mode magnetic fields and valid speed and direction over larger air gaps, commonly required in wheel speed sensing applications. Patented GMR technology allows the same orientation as Hall-effect for a drop-in solution in the application. Integrated diagnostics are used to detect an IC failure which impacts the output protocol’s accuracy, providing coverage compatiblewithASILBcompliance.Built-inEEPROMscratch memory offers traceability of the device throughout the IC’s production process. The IC is offered in the UB package, which integrates the IC and a high-temperature ceramic capacitor in a single overmold SIP package for enhanced EMC performance. The 2-pin SIP package is lead (Pb) free, with tin leadframe plating. PACKAGE: Not to scale FEATURES AND BENEFITS DESCRIPTION 2-Pin SIP (suffix UB) November 16, 2018 Figure 1: Functional Block Diagram + – + – ADC ADC Analog-to-Digital and Signal Conditioning Front End Amplification GMR Elements Digital Controller VCC GND EEPROM Oscillator Diagnostics Regulator Output Current Generator ESD 2 - |
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