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ADSP-TS202S Datasheet(PDF) 21 Page - Analog Devices

Part # ADSP-TS202S
Description  TigerSHARC Embedded Processor
PDF  40 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADSP-TS202S Datasheet(HTML) 21 Page - Analog Devices

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ADSP-TS202S
Preliminary Technical Data
Rev. PrB
|
Page 21 of 40
|
December 2003
ADSP-TS202S—SPECIFICATIONS
Note that component specifications are subject to change with-
out notice. For information on Link port electrical
characteristics, see Link Port Low-Voltage, Differential-Signal
(LVDS) Electrical Characteristics and Timing on page 27.
RECOMMENDED OPERATING CONDITIONS
ELECTRICAL CHARACTERISTICS
Parameter
Test Conditions
Min
Typ
Max
Unit
VDD
Internal Supply Voltage
0.95
1.05
V
VDD_A
Analog Supply Voltage
0.95
1.05
V
VDD_IO
I/O Supply Voltage
2.38
2.63
V
VDD_DRAM
Internal DRAM Supply Voltage
1.425
1.575 V
TCASE
Case Operating Temperature
–40
+85
°C
VIH
High-Level Input Voltage
1
1 Applies to input and bidirectional pins.
@ VDD, VDD_IO = max
1.7
3.63
V
VIL
Low-Level Input Voltage1
@ VDD, VDD_IO = min
–0.5
0.8
V
IDD
VDD supply current for typical activity
2
2 For details on internal and external power calculation issues, see the EE-170, Estimating Power for the ADSP-TS201S on the Analog Devices website.
@ CCLK=500 MHz, VDD=1.0 V, TCASE=25ºC
2.39
A
IDD_A
VDD_A supply current for typical activity
@ CCLK=500 MHz, VDD=1.0 V, TCASE=25ºC
20
50
mA
IDD_IO
VDD_IO supply current for typical activity
2 (DRAM
Internal Regulator Disabled)
@ SCLK=100 MHz, VDD_IO=2.5 V, TCASE=25ºC,
ENEDREG=0
0.16
A
IDD_DRAM
VDD_DRAM supply current for typical activity
2
@ CCLK=500 MHz, VDD_DRAM=1.5 V,
TCASE=25ºC, ENEDREG=0
0.40
A
VREF
Voltage reference
(VDD_IO ×0.56)
3
3 If the clock driver voltage is > 2.8 V and the clock driver voltage is used to generate SCLK_VREF, this formula becomes: (VCLOCK_DRIVE/2) ±5%)
V
SCLK_VREF
Voltage reference
(VDD_IO ×0.56)
3
V
Parameter
Test Conditions
Min
Max
Unit
VOH
High-Level Output Voltage
1
1 Applies to output and bidirectional pins.
@VDD_IO =min, IOH = –2 mA
2.18
V
VOL
Low-Level Output Voltage1
@VDD_IO =min, IOL =4 mA
0.4
V
IIH
High-Level Input Current
@VDD_IO =max, VIN =VDD_IO max
10
µA
IIH_PU
High-Level Input Current
@VDD_IO =max, VIN =VDD_IO max
50
µA
IIH_PD
High-Level Input Current
@VDD_IO =max, VIN =VDD_IO max
0.3
0.76
mA
IIL
Low-Level Input Current
@VDD_IO =max, VIN =0V
10
µA
IIL_PU
Low-Level Input Current
@VDD_IO =max, VIN =0V
0.3
0.76
mA
IIL_PU_AD
Low-Level Input Current
@VDD_IO =max, VIN = 0V
0.03
0.1
mA
IOZH
Three-State Leakage Current High
@VDD_IO =max, VIN =VDD_IO max
10
µA
IOZH_PD
Three-State Leakage Current High
@VDD_IO =max, VIN =VDD_IO max
0.3
0.76
mA
IOZL
Three-State Leakage Current Low
@VDD_IO =max, VIN =0V
10
µA
IOZL_PU
Three-State Leakage Current Low
@VDD_IO =max, VIN =0
0.3
0.76
mA
IOZL_PU_AD
Three-State Leakage Current Low
@VDD_IO =max, VIN = 0
0.03
0.1
mA
IOZL_OD
Three-State Leakage Current Low
@VDD_IO =max, VIN =0V
4
7.6
mA
CIN
Input Capacitance2,3
2 Applies to all signals.
3 Guaranteed but not tested.
@fIN =1MHz,TCASE =25C, VIN =2.5V
3
pF
Parameter name suffix conventions: no suffix = applies to pins without pullup or pull down resistors, _PD = applies to pin types (pd) or
(pd_0), _PU = applies to pin types (pu) or (pu_0), _PU_AD = applies to pin types (pu_ad), _OD = applies to pin types OD



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