Data Sheet

ADuCM330WFS/ADuCM331WFS

Rev. A | Page 17 of 17

OUTLINE DIMENSIONS

1

0.50

BSC

32

9

16

17

24

25

8

0.05 MAX

0.02 NOM

0.15 REF

COPLANARITY

0.08

0.30

0.25

0.18

6.10

6.00 SQ

5.90

1.00

0.95

0.85

0.70

0.60

0.50

0.20 MIN

3.90

3.80 SQ

3.70

COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-7

TOP VIEW

EXPOSED

PAD

BOTTOM VIEW

END VIEW

P IN 1

IN D IC AT O R AR E A OP T IO N S

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

PIN 1

INDICATOR

AREA

SEATING

PLANE

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 4. 32-Lead Lead Frame Chip Scale Package [LFCSP]

6 mm × 6 mm Body and 0.95 mm Package Height

(CP-32-15)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature

Program Flash/

Data Flash/SRAM

Package Description

Package

Option

ADuCM330WFSBCPZ-RL

−40°C to +115°C

96 kB/4 kB/10 kB

32-Lead Frame Chip Scale Package [LFCSP]

CP-32-15

ADuCM331WFSBCPZ-RL

−40°C to +115°C

128 kB/4 kB/10 kB

32-Lead Frame Chip Scale Package [LFCSP]

CP-32-15

EVAL-ADUCM331QSPZ

Socketed Evaluation Board with Switches and LEDs

1

Z = RoHS Compliant Part.

2

W = Qualified for Automotive Applications.

3

The ADuCM330WFS/ADuCM331WFS are functional but have degraded performance at temperatures from 115°C to 125°C.

AUTOMOTIVE PRODUCTS

The ADuCM330WFS and ADuCM331WFS models are available with controlled manufacturing to support the quality and reliability

requirements of automotive applications. Note that these automotive models may have specifications that differ from the commercial

model; therefore, designers should review the Specifications section of this data sheet carefully. Only the automotive grade products

shown are available for use in automotive applications. Contact your local Analog Devices, Inc., account representative for specific

product ordering information and to obtain the specific Automotive Reliability reports for these models.

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D17188-0-2/19(A)