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KMM372V413CS Datasheet(PDF) 6 Page - Samsung semiconductor

Part # KMM372V413CS
Description  4M x 72 DRAM DIMM with ECC using 2Mx8, Dual Bank 2K Refresh, 3.3V
PDF  19 Pages
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

KMM372V413CS Datasheet(HTML) 6 Page - Samsung semiconductor

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DRAM MODULE
KMM372V413CK/CS
NOTES
An initial pause of 200us is required after power-up followed
by any 8 RAS-only or CAS-before-RAS refresh cycles before
proper device operation is achieved.
Input voltage levels are Vih/Vil. VIH(min) and VIL(max) are ref-
erence levels for measuring timing of input signals. Transition
times are measured between VIH(min) and VIL(max) and are
assumed to be 5ns for all inputs.
Measured with a load equivalent to 1TTL loads and 100pF.
Voh=2.0V and Vol=0.8V.
Operation within the
tRCD(max) limit insures that tRAC(max)
can be met.
tRCD(max) is specified as a reference point only.
If
tRCD is greater than the specified tRCD(max) limit, then
access time is controlled exclusively by
tCAC.
Assumes that
tRCD
≥tRCD(max).
This parameter defines the time at which the output achieves
the open circuit condition and is not referenced to VOH or VOL.
tWCS is not restrictive operating parameter. It included in the
data sheet as electrical characteristic only. If
tWCS
≥tWCS(min)
the cycle is an early write cycle and the data out pin will
remain high impedance for the duration of the cycle.
Either
tRCH or tRRH must be satisfied for a read cycle.
These parameters are referenced to the CAS leading edge in
early write cycles.
Operation within the
tRAD(max) limit insures that tRAC(max)
can be met.
tRAD(max) is specified as reference point only. If
tRAD is greater than the specified tRAD(max) limit, then access
time is controlled by
tAA.
The timing skew from the DRAM to the DIMM resulted from
the addition of buffers.
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