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L6258E Datasheet(PDF) 4 Page - STMicroelectronics |
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L6258E Datasheet(HTML) 4 Page - STMicroelectronics |
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4 / 24 page ![]() L6258E 4/24 Figure 4. Thermal Characteristics Conditions Power Dissipated (W) T Ambient (˚C) Thermal J-A resistance (˚C/W) 5.3 70 15 4.0 70 20 2.3 70 35 pad layout + ground layers + 16 via hol PCB ref.: 4 LAYER cm 12 x 12 pad layout + ground layers PCB ref.: 4 LAYER cm 12 x 12 pad layout + 6cm2 on board heat sink PCB ref.: 2 LAYER cm 12 x 12 D02IN1370 0 0 2 4 6 8 15˚C/W 20˚C/W 35˚C/W 10 12 20 40 60 80 100 120 140 160 Ambient Temperature (˚C) D02IN1371 |
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