Approval sheet

Page 4 of 7

ASC_VH0201 Green Series- V04

Aug.2018

Enviromental Reliability Test

Characteristic

Test method and description

High Temperature

Storage

The specimen shall subjected to 125 ± 2 ℃ for 1000 ± 12hours in a thermostatic bath without

load and then stored at room temperature and humidity for 1 to 2 hours.

The change of varistor voltage shall be within 10 ％

Temperature Cycle

The temperature cycle of specified temperature

shall be repeated five times and then stored at

room temperature and humidity fir one or two

hours. The change of varistor voltage shall be

within 10 ％ and mechanical damage shall be

examined.

Step

Temperature

Period

1

-40 ± 3 ℃

30Min ±3

2

Room Temperature

1~2 hours

3

125 ± 2 ℃

30Min ±3

4

Room Temperature

1~2 hours

High Temperature

Load

After being continuously applied the maximum allowable voltage at 85 ± 2 ℃ for 1000 ±

2hours, the specimen shall be stored at room temperature and humidity for one or two hours.

The change of varistor voltage shall be within 10％

Damp Heat Load/

Humidity Load

The specimen should be subjected to 40 ± 2 ℃, 90 to 95 ％ RH environment, and the

maximum allowable voltage applied for 1000 hours, then stored at room temperature and

humidity for one or two hours. The change varistor voltage shall be within 10 ％

Low Temperature

Storage

The specimen should be subjected to -40 ± 2 ℃, without load for 500 hours and then stored

at room temperature for one or two hours. The change of varistor voltage shall be within 10

％

SOLDERING CONDITION

1.

The IR reflow and temperature of Soldering for Pb free

IR reflow Pb Free Process suggestion profile

(1) The solder recommend is Sn96.5/Ag .5 of 120 to 150

μm

(2) Ramp-up rate (217℃ to Peak)+3℃/second max

(3) Temp. maintain at 175+/-25℃ 180 second max

(4) Temp. maintain above 217℃ 60-150 seconds

(5) Peak temperature range 245℃ +20℃/+10℃ time within 5℃ of actually peak temperature (tp) 10~20 seconds

(6) Ramp down rate +6℃/second max.

※Perform adequate test in advance as the reflow temperature profile will vary according to the conditions of the

manufacturing process, and the specification of the reflow furnace.