SL2S1502FUD datasheet(4/33 Pages) NXP

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NXP Semiconductors

SL2S1402_SL2S1502_SL2S1602

ICODE ILT

SL2S1402_SL2S1502_SL2S1602

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Product data sheet

Rev. 3.3 — 15 October 2019

COMPANY PUBLIC

234333

4 / 33

4 Ordering information

Table 1. Ordering information

Type number

Package

Name

Description

Version

SL2S1402FUD

Wafer

sawn, bumped wafer, 120 μm, on film frame

carrier,

Ci between LA and LB = 0 pF (typical)

SL2S1402FUF

Wafer

sawn, bumped wafer, 75 μm, on film frame carrier,

Ci between LA and LB = 0 pF (typical)

SL2S1502FUD

Wafer

sawn, bumped wafer, 120 μm, on film frame

carrier,

Ci between LA and LB = 23.5 pF (typical)

SL2S1502FUF

Wafer

sawn, bumped wafer, 75 μm, on film frame carrier,

Ci between LA and LB = 23.5 pF (typical)

SL2S1602FUD

Wafer

sawn, bumped wafer, 120 μm, on film frame

carrier,

Ci between LA and LB = 97 pF (typical)

SL2S1502FTB

XSON3

plastic extremely thin small outline package; no

leads; 3 terminals; body 1 x 1.45 x 0.5 mm;

Ci between LA and LB = 23.5 pF (typical)

SOT1122

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