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AT21CS01 Datasheet(PDF) 1 Page - Microchip Technology

Part # AT21CS01
Description  Single-Wire, I/O Powered 1-Kbit (128 x 8) Serial EEPROM with a Unique, Factory-Programmed 64-Bit Serial Number
PDF  47 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

AT21CS01 Datasheet(HTML) 1 Page - Microchip Technology

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AT21CS01/AT21CS11
Single-Wire, I/O Powered 1-Kbit (128 x 8) Serial EEPROM
with a Unique, Factory-Programmed 64-Bit Serial Number
Features
•
Low
‑Voltage Operation:
–
AT21CS01 is self-powered via the 1.7V to 3.6V pull
‑up voltage on the SI/O line
–
AT21CS11 is self-powered via the 2.7V to 4.5V pull
‑up voltage on the SI/O line
•
Internally Organized as 128 Words of Eight Bits Each (1-Kbit)
•
Single-Wire Serial Interface with I2C Protocol Structure:
–
Device communication is achieved through a single I/O pin
•
Standard Speed and High-Speed Mode Options:
–
15.4 kbps maximum bit rate in Standard Speed mode (AT21CS01 only)
–
125 kbps maximum bit rate in High-Speed mode (AT21CS01 and AT21CS11)
•
8
‑Byte Page Write or Single Byte Writes Allowed
•
Discovery Response Feature for Quick Detection of Devices on the Bus
•
ROM Zone Support:
–
Device is segmented into four 256
‑bit zones, each of which can be permanently made
read
‑only (ROM)
•
256
‑bit Security Register:
–
Lower eight bytes contains a factory-programmed, read-only, 64
‑bit serial number that is
unique to all Microchip single
‑wire products
–
Next eight bytes are reserved for future use and will read FFh
–
Upper 16 bytes are user
‑programmable and permanently lockable
•
Self
‑Timed Write Cycle (5 ms maximum)
•
Manufacturer Identification Register:
–
Device responds with unique value for Microchip as well as density and revision information
•
High Reliability:
–
Endurance: 1,000,000 write cycles
–
Data retention: 100 years
–
IEC 61000-4-2 Level 4 ESD Compliant (±8 kV Contact, ±15 kV Air Discharge)
•
Green (Lead-free/Halide-free/RoHS Compliant) Package Options
•
Die Sale Options in Wafer Form and Tape and Reel
Packages
2-pad XSFN, 3-lead SOT23, 8-lead SOIC and 4-ball thin WLCSP.
© 2017 Microchip Technology Inc.
Datasheet
DS20005857A-page 1


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