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HCTS7266K/SAMPLE Datasheet(PDF) 8 Page - Intersil Corporation |
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HCTS7266K/SAMPLE Datasheet(HTML) 8 Page - Intersil Corporation |
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8 / 8 page ![]() 8 HCTS7266MS Die Characteristics DIE DIMENSIONS: 84 x 84 mils 2.20 x 2.24mm METALLIZATION: Type: SiAl Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 x 4mm Metallization Mask Layout HCTS7266MS NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCTS7266 is TA14436A. A1 VCC B4 B1 (2) Y1 (3) Y2 (4) A2 (5) (6) (7) (8) (9) B3 (10) Y3 (11) Y4 (12) A4 (1) (14) (13) B2 GND A3 Spec Number 518627 |
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