R2

R4

AMC3306

Clearance area, to be

kept free of any

conductive materials.

To MCU I/O (optional)

From Clock Source (MCU)

To Digital Filter (MCU)

GND

INP

INN

3.3-V or 5-V supply

HGND

VDD

CLKIN

DOUT

DIAG

Top Metal

Inner or Bottom Layer Metal

Via

23

AMC3306M25

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Table 2 lists components suitable for use with the AMC3306M25. This list is not exhaustive. Other components

may exist that are equally suitable (or better), however these listed components have been validated during the

development of the AMC3306M25.

Table 2. Recommended External Components

DESCRIPTION

PART NUMBER

MANUFACTURER

SIZE (EIA, L x W)

VDD

C8

1 nF ± 10%, X7R, 50 V

12065C102KAT2A

AVX

1206, 3.2 mm x 1.6 mm

C9

1 µF ± 10%, X7R, 25 V

12063C105KAT2A

AVX

1206, 3.2 mm x 1.6 mm

DC/DC CONVERTER

C4

100 nF ± 10%, X7R, 50 V

C0603C104K5RACAUTO

Kemet

0603, 1.6 mm x 0.8 mm

C3

1 nF ± 10%, X7R, 50 V

C0603C102K5RACTU

Kemet

0603, 1.6 mm x 0.8 mm

C2

1 µF ± 10%, X7R, 25 V

CGA3E1X7R1E105K080AC

TDK

0603, 1.6 mm x 0.8 mm

HLDO

C1

100 nF ± 10%, X7R, 50 V

C0603C104K5RACAUTO

Kemet

0603, 1.6 mm x 0.8 mm

C5

100 nF ± 5%, NP0, 50 V

C3216NP01H104J160AA

TDK

1206, 3.2 mm x 1.6 mm

C6

1 nF ± 10%, X7R, 50 V

12065C102KAT2A

AVX

1206, 3.2 mm x 1.6 mm

10 Layout

10.1 Layout Guidelines

Figure 18 shows a layout recommendation with the critical placement of the decoupling capacitors. The same

reference designators are used as in the Power Supply Recommendations section. Decoupling capacitors are

placed as close as possible to the AMC3306M25 supply pins. For best performance, place the shunt resistor

close to the INP and INN inputs of the AMC3306M25 and keep the layout of both connections symmetrical.

This layout is used on the AMC3306M25 EVM and supports CISPR-11 compliant electromagnetic radiation

levels.

10.2 Layout Example

Figure 18. Recommended Layout of the AMC3306M25