MXT1664T3 datasheet(89/98 Pages) MICROCHIP

89 / 98 page

 2018 Microchip Technology Inc.

DS40002054A-page 89

MXT1664T3 2.0

APPENDIX B:

REVISION HISTORY

Revision AX (January 2015)

Final edition for firmware revision 2.0 – Atmel Release version

Revision A (August 2018)

Reformatted edition for firmware revision 2.0 – Microchip Release version

This revision incorporates the following updates:

• Updated to Microchip datasheet format:

- “Pin configuration” moved to start of datasheet

- “To Our Valued Customers” added

- Section 15.0 “Packaging Information” updated with new headings. Part numbers moved to “Product

Identification System”

- Associated Documents moved to Appendix A “Associated Documents”

- Revision History moved to this appendix

- Index added

- “Product Identification System” added

- “The Microchip Web Site”, “Customer Change Notification Service” and “Customer Support” sections added

- Front and back covers updated

•Features:

- Typical touchscreen size updated

- Touch Sensor Technology section added

- Panel / cover glass support section replaced by Front Panel Material. Recommended panel thickness for

glass and plastic revised

- Advanced Touch Handling section merged into Touch Performance section. Burst Frequency and Scan

Speed one finger reporting rate added

- Application Interfaces: SPI Debug Interface added

- Design Services section added

- Other feature points rearranged

• “Pin configuration”:

-DBG_SS/TEST pin now recommends pull up to VddIO

- Pin listing tables updated to show power rail information

• Section 1.0 “Overview of mXT1664T3”:

- Touch detection description updated

• Section 2.0 “Schematics”:

- Schematic drawing modified to show the maximum number of decoupling capacitors required. Pull-up

resistors added for completeness to COMMSEL (USB mode) and TEST lines. Some pins rearranged

- Section 2.5.1 “Power Supply”: New section added

- Section 2.5.2 “Decoupling capacitors”: Advice on decoupling capacitors modified to recommend maximum

number of decoupling capacitors

- Section 2.5.3 “Pull-up Resistors”: New section added

- Section RESET Line removed (capacitor to GND no longer considered optional)

- Section 2.5.4 “Voltage Booster”: Information on 47 µH inductors added for low voltage mode

- Low Drop-Out Voltage Regulators (LDOs) section removed. Information moved to Section 11.0 “PCB Design

Considerations”

- Section I2C Interface removed (information moved elsewhere)

- Section 2.5.6 “XTAL_XOUT and XTAL_XIN” added

- Section 2.5.8 “GPIO Pins”: Updated with information moved from elsewhere

- Section 2.5.9 “SPI Debug Interface”: New section

• Circuit Components section removed and contents merged into Section 11.0 “PCB Design Considerations”

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