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EXPRESS-CF Datasheet(PDF) 2 Page - Adlink Technology Inc.

Part # EXPRESS-CF
Description  COM Express Basic Size Type 6 Module
PDF  4 Pages
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Manufacturer  ADLINK [Adlink Technology Inc.]
Direct Link  https://www.adlinktech.com/en/index
Logo ADLINK - Adlink Technology Inc.

EXPRESS-CF Datasheet(HTML) 2 Page - Adlink Technology Inc.

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Specifications
Multi I/O and Storage
USB: 4x USB 3.1 (USB 0, 1, 2, 3) and 4x USB 2.0 (USB 4, 5, 6, 7)
SATA: Four ports SATA 6Gb/s (SATA0,1,2,3)
Serial: 2 UART ports with console redirection
GPIO/SD: 4 GPO and 4 GPI (GPI with interrupt)
SD/GPIO muxed design, switched by BIOS setting
SD functions as storage device only
Note: USB 3.1 Gen2 support dependent on carrier design
Super I/O
Supported on carrier if needed (standard support for W83627DHG-P)
TPM
Chipset: Infineon
Type: TPM 2.0
Power
Standard Input: ATX = 12V ±5% / 5Vsb ±5% or AT = 12V ±5%
Wide Input: ATX = 8.5-20 V / 5Vsb ±5% or AT = 8.5-20V
Management: ACPI 5.0 compliant, Smart Battery support
Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/S4,
WOL S3/S4/S5)
ECO mode: Supports deep S5 mode for power saving
Operating Systems
Standard Support
Windows® 10 64-bit, Linux 64-bit
Extended Support (BSP)
Linux 64-bit
Mechanical and Environmental
Form Factor: PICMG COM.0, Rev 3.0 Type 6
Dimension: Basic size: 125 mm x 95 mm
Operating Temperature
Standard: 0°C to 60°C
Storage Temperature: -20°C to 80°C
Humidity
5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration
IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A,
Table 214-I, Condition D
HALT
Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
Notes:
* All specifications are subject to change without further notice.
* For CPU and chipset combinations not listed, please contact your ADLINK representative for availability.



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